Additive manufacturing: Application and validation of machine learning-based process-structure-property linkages in Ti-6Al-4V

Xi Gong, Willem Groeneveld-Meijer, Guha P. Manogharan

Materials Science in Additive Manufacturing 2023 article cited by 14

Source Open-access PDF More in Engineering & Materials

importance 5/10 partially solved Additive Manufacturing Materials and Processes additive manufacturing stage: research

Problem

Predicting how additive manufacturing process conditions and heat treatments affect the microstructure, properties and machining behavior of Ti-6Al-4V.

Why it matters

Reliable process-structure-property linkages let manufacturers choose AM conditions that guarantee material performance.

What the AI did

A machine learning workflow combining statistical microstructure descriptors, a cutting force model and data mining was built and validated to create process-structure-property linkages for metal AM.

Results

Method claimed proven valid for PSP linkages; prediction accuracy found highly correlated with AM process, build orientation and machining conditions (no numbers in abstract).

Impact

The abstract claims a validated ML workflow, but no quantitative accuracy figures are given.

Record

Venue	Materials Science in Additive Manufacturing
Published	2023
Work type	article
Authors	Xi Gong, Willem Groeneveld-Meijer, Guha P. Manogharan
Citations	14 (OpenAlex, at import time)
Model or method	not stated in source
Organization	not stated in source
Primary source	https://doi.org/10.36922/msam.0999
Open access	hybrid
Keywords	additive manufacturing, Ti-6Al-4V, machine learning, process-structure-property, powder bed fusion, directed energy deposition

Importance rating

5 / 10

real but narrower advance

Process-structure-property linkages for metal AM of Ti-6Al-4V matter to manufacturers, but abstract gives no scale of impact; a real but narrow materials advance.

Basis: inferred. Judged from the source text, which gives no explicit scale. Stated scale: not stated in source. Method and limits.

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